Zen architecture, technical base of AMD Ryzen processors, is celebrating 5 years this week. The opportunity for the brand to come back on one of its biggest successes to date, and to draw a few prospects, such as the next introduction to the Zen 3 chip market integrating 3D v-cache technology.
April 2017 ... This is the date we tested our first Ryzen stamped processors. Period that has seen some of our certainties switch, since after years of cerebral death, the AMD CPU division signed an improbable return, until the situation we know: AMD is now in technological leader, Thanks to the 7 Nm engraving technologies of its partner, and its chiplet approach, which aims to position the elements benefiting from a different manufacturing process: 7 nm for the hearts, but 12 nm for the part I / O (and in opposition to Intel s monolithic strategy). Therefore, difficult to blame AMD this little moment of autoconglation. Especially since it was an opportunity for trademark managers to do some ads on their roadmap for the next few months.
First appointment not to be missed: The arrival of new Zen processors 3 start 2022 . Finally new ... In truth, it would be the same Ryzen 5000 chips that we already know, with possibly some frequency adjustments, but in any case without major change of architecture. Everything will be played on the manufacture, and how to integrate cache memory. Currently, the functional elements of a processor (cores, IGPU, cache, modem, etc.) are positioned on the same plane, which necessarily obliges compromises, the surface of a die being not expandable to the infinite. AMD intends to provide a partial response to this constraint, by integrating its cache either on a plan, but in 3D, stacking layers of components connected with each other and CCDs by TSV (for through silicon vias , vertical channels. will allow communication between the different levels of the new die). In doing so, the AMD teams feel capable of increasing the size of the l3 cache of a factor 3.
Lisa Su had presented at the last computex a prototype of Ryzen 9 5900x chips integrating this technology and having a 192 MB L3 cache reserve. The very design of the memory would also improve latency, the set offering 15% performance gains on average. What no doubt, deal with Alder Lake, while waiting for the next generation of processor, which Refit on Zen architecture 4. The launch of the latter is expected for the second half of 2022, and will sign a number of novelties: PCIe support 5.0, DDR5 memory support, introduction of a new AM5 socket.
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